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It is a possible high temperature hot plate superior in semiconductor wafer heating
temperature uniform performance for high temperature (350 °C).
We achieved a quick response for rising and falling temperature,
special incidental facilities were unnecessary, and developed the hot plate of
rising and falling temperature type for semiconductor production equipment
superior in plane uniformity at the time of temperature setting change.
We design and produce the baking equipment showing the performance of these hot plates
to the maximum.
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Hot plate / Cool plate |
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- For 6 inch wafer
- For 8 inch wafer
- For 8 inch wafer. Rising and falling temperature type.
- For 12 inch wafer
- 1 zone control
- 3 zone control
- 7 zone control
- For 12 inch wafer. Rising and falling temperature type.
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Hot plate unit / Cool plate unit |
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Temperature
uniform performance of the semiconductor wafer heating is superior
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Figure of thermo viewer
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Temperature precision in plane of 12 inch wafer
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Wafer processing temperature [°C] |
Temperature range [°C] |
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60
~ 90 |
R<0.2 |
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90.1~110 |
R<0.24 |
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110.1~150 |
R<0.3 |
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150.1~200 |
R<0.6 |
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200.1~250 |
R<0.8 |
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250.1~300 |
R<1.0 |
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300.1~350 |
R<1.5 |
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Rising and falling temperature type hot plate which
achieved quick response
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Temperature control graph
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Temperature setting change time : 180[sec] / 50[°C]
(Time before control temperature beginning to be stable at set point within
±0.3 [°C] from temperature setting change start.)
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